Encapsulant compositions with thermal shock resistance
Assignee3M Innovative Properties Company
InventorsRichard M. Bymark, Frank Y. Xu, Rolf W. Biernath, Michael A. Kropp, Wayne S. Mahoney, Taun L. McKenzie, Wendy L. Thompson
Life of this patent
Estimating the term…
Abstract
A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.
Claims17
A thermomechanical-shock-resistant curable composition for solventless, hydrophobic resin encapsulation of electronic components, said composition comprising:
- a non-silicone oligomer including a flexible hydrocarbon backbone having reactive functionality selected from epoxy groups, (meth)acrylate groups, carboxyl groups, hydroxyl groups, isocyanate groups, amine groups, phenolic groups, anhydride groups, alkyd groups, cyanate ester groups, silyl groups, and mercapto groups;
- up to about 40% by weight of an adhesion promoter, and
- optionally, a viscosity-modifying component,
- wherein said composition has a glass transition temperature below 0° C. when cured.
A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components, said cured composition comprising a plurality of polymers forming an interpenetrating polymer network produced by thermally curing a liquid composition comprising:
- a non-silicone oligomer including a flexible hydrocarbon backbone having reactive functionality selected from epoxy groups, (meth)acrylate groups, carboxyl groups, hydroxyl groups, isocyanate groups, amine groups, phenolic groups, anhydride groups, alkyd groups, cyanate ester groups, silyl groups, and mercapto groups;
- up to about 40% of an adhesion promoter;
- and
- a viscosity-modifying component,
- wherein said cured composition has a glass transition temperature below 0° C.
A thermomechanical-shock-resistant cured composition according to claim5 wherein said organofunctional silane coupling agent is an isocyanatoalkyltrialkoxy silane coupling agent.
Dependencies are inferred from the claim text.