Plating system workpiece support having workpiece engaging electrode

A method of electroplating material on a surface of a semiconductor workpiece, comprising:

• positioning the workpiece between a generally circular workpiece support and a plurality of electrodes, the workpiece support comprising a first columnar member and a second columnar member, the plurality of electrodes comprising a first electrode and a second electrode, wherein the electrodes have a first section spaced radially outward with respect to the columnar members and a second section extending laterally with respect to the first section, and wherein the second section has a contact face;
• providing relative movement between the workpiece support and the plurality of electrodes to bear the first and second columnar members against two spaced-apart locations on a first surface of the workpiece and to electrically contact a first location on a second surface of the workpiece with the contact face of the first electrode and electrically contact a second location on the second surface of the workpiece with the contact face of the second electrode;
• wetting a portion of the workpiece with a plating liquid;
• and
• delivering an electrical current to the workpiece via the plurality of electrodes to deposit the material on the workpiece.