Dual track stenciling system with solder gathering head

Abstract

A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, the solder dispensing unit includes a squeegee arm with a solder gathering head. During operation using the squeegee arm with the solder gathering head, two circuit boards are fed to the working area, and both of the circuit boards are serially processed, with excess solder being removed from the board after the processing of each of the boards.

Dependencies are inferred from the claim text.