Wafer rotation randomization in cluster tool processing

A system for tracking wafers in a multiple chamber subsystem of a wafer processing system having at least two processing parameters, the system comprising:

• means for presenting a wafer into a first chamber;
• means for determining respective first and second angles of rotation of the wafer as the wafer moves into the first chamber and subsequently into a second chamber;
• and
• means for recording the second rotation angle relative to the first angle of rotation and a corresponding chamber location of the wafer as the wafer moves through each chamber of the multiple chamber subsystem.

A method for detecting a processing deviation in a multiple chamber subsystem of a wafer processing system, the subsystem having at least two processing parameters, the method comprising:

• presenting a wafer into a first chamber;
• imparting an angle of rotation on the wafer as the wafer is moved into each of the first and a second chamber;
• recording the angles of rotation for the wafer and the corresponding chamber location of the wafer in the multiple chamber subsystem;
• and
• analyzing the wafer for any deviations indicating a variance of the processing parameters.

A system for detecting a processing deviation in a multiple chamber subsystem of a wafer processing system, the subsystem having at least two processing parameters, the system comprising:

• means for presenting a wafer into a first chamber;
• means for imparting an angle of rotation on the wafer as the wafer moves into each of the first and a second chamber;
• means for recording the angles of rotation for the wafer and the corresponding chamber location of the wafer as the wafer moves through each chamber of the multiple chamber subsystem;
• and
• means for analyzing the wafer for any deviations indicating a variance from the processing parameters.

A system for detecting a processing deviation in a multiple chamber subsystem of a wafer processing system, the subsystem having at least two processing parameters, the system comprising:

• a mechanical arm that presents a wafer into a first chamber;
• a rotating device for imparting an angle of rotation on the wafer as the wafer moves into each of the first and a second chamber;
• an analyzer arrangement that analyzes the wafer for any deviations indicating a variance from the processing parameters;
• and
• a computer arrangement adapted to record the angles of rotation for the wafer and the corresponding chamber location in the subsystem.

A system for detecting a processing deviation in a multiple chamber subsystem of a wafer processing system, the subsystem having at least two processing parameters, the system comprising:

• a mechanical arm that presents a wafer into a first chamber;
• a rotating device for imparting an angle of rotation on the wafer as the wafer moves into each of the first and a second chamber;
• an analyzer arrangement that analyzes the wafer for any deviations indicating a variance from the processing parameters;
• a computer arrangement adapted to record the angles of rotation for the wafer and the corresponding chamber location in the subsystem and further adapted to correlate the wafer deviation to at least one of the chambers;
• and
• a wafer carrier movement detector for determining the rate of rotation of a carrier moving from the first chamber to the second chamber, wherein the movement detector data is recorded and incorporated into correlation analysis performed by the computer arrangement.