Device for enhancing the local cooling of electronic packages subject to laminar air flow
AssigneeAgilent Technologies, Inc.
InventorWalter J. Dauksher
Life of this patent
Estimating the term…
Abstract
A device having features for enhancing the cooling of an electronic package subject to laminar air flow. The features include a bluff body, located adjacent the electronic package and within the laminar air flow, for creating turbulence in the air flow to enhance the cooling of the package. The turbulence creates a greater cooling effect of the air flow on the electronic package, and the bluff body can include a rod or other structure mounted adjacent the electronic package. The bluff body can also be mounted on the electronic package or on a heat sink mounted on top of the package.
Claims20
A device for enhancing cooling of an electronic package subject to laminar air flow, comprising:
- an electronic package subject to laminar air flow over the package for cooling of the package;
- and
- a bluff body, located adjacent and upstream of the electronic package and within the laminar air flow, for creating turbulence in the air flow to enhance the cooling of the package, wherein the bluff body is mounted adjacent the electronic package via a movable mount allowing the bluff body to fluctuate in the air flow.
A method for enhancing cooling of an electronic package subject to laminar air flow, comprising:
- providing an electronic package subject to laminar air flow over the package for cooling of the package;
- creating turbulence in the air flow, using a bluff body in the air flow, to enhance the cooling of the package;
- and
- allowing the bluff body to fluctuate in the air flow via a movable mount.
Dependencies are inferred from the claim text.