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US 6,661,090 B1Granted
Metal adhesion layer in an integrated circuit package
AssigneeSilicon Light Machines Corporation
InventorsOmar S. Leung, Josef Berger
Life of this patent
Estimating the term…
Abstract
In one embodiment, an integrated circuit packaging structure includes a first metal adhesion layer formed under a lid and a second metal adhesion layer formed over a substrate. The lid includes a free surface that may move a small amount without cracking. The second metal adhesion layer is configured such that its outer end does not extend past the free surface of the lid to minimize crack formation.
Claims15
An integrated circuit packaging structure comprising:
- a first metal adhesion layer having an outer end, the first metal adhesion layer being under a lid having a free surface;
- and
- a second metal adhesion layer under the first metal adhesion layer, the second metal adhesion layer having an outer end, wherein the outer end of the first metal adhesion layer extends past the outer end of the second metal adhesion layer.
An integrated circuit packaging structure comprising:
- a first adhesion means for providing a first adhesion surface, the first adhesion means being disposed under a free surface;
- a second adhesion means for providing a second adhesion surface, the second adhesion means being under the first adhesion means;
- and
- means for bonding the first adhesion means and the second adhesion means such than an outer end of the first adhesion means extends past an outer end of the second adhesion means.
1 more element
Dependencies are inferred from the claim text.