Method for forming crack resistant planarizing layer within microelectronic fabrication

A method for fabricating an image array optoelectronic microelectronic fabrication comprising:

• providing a substrate employed within an image array optoelectronic microelectronic fabrication, the substrata having formed thereover a topographic feature;
• forming upon the substrate including the topographic feature a planarizing layer formed from a negative photoresist planarizing material;
• partially photoexposing the planarizing layer to form a partially photoexposed planarizing layer;
• forming upon the partially photoexposed planarizing layer a sacrificial layer;
• and
• sequentially:
• stripping the sacrificial layer from the partially photoexposed planarizing layer;
• and
• developing the partially-photoexposed planarizing layer to form a developed planarizing layer planarizing the topographic feature.