Semiconductor device and a manufacturing method thereof

A method of manufacturing a semiconductor device, including:

• forming process of forming a semiconductor element on a semiconductor wafer, and
• testing process of testing electrical performance of said formed semiconductor element,
• said testing process including connecting process of electrically connecting a testing apparatus to electrode pads formed on said semiconductor element to be tested, and
• said connecting process electrically connecting said testing apparatus to said electrode pads,
• said testing apparatus having a probe-formed substrate comprising a beam having a probe to be electrically connected to said electrode pad and a plurality of secondary electrodes connected to said probe through wiring, and said probe-formed substrate having a first wiring for connection with a first probe and having a first wiring width and a second wiring for connection with a second probe and having a second wiring width larger than said first wiring width.

A method of manufacturing a semiconductor device, including:

• forming process of forming a semiconductor element on a semiconductor wafer, and
• testing process of testing electrical performance of said formed semiconductor element,
• said testing process including connecting process of electrically connecting a testing apparatus to an electrode pad formed on said semiconductor element to be tested,
• said connecting process electrically connecting said testing apparatus to said electrode pad,
• said testing apparatus having a probe-formed substrate comprising a plurality of beams formed thinner than the thickness of surroundings, said beams comprising a first beam having a probe to be electrically connected to said electrode pad and a second beam having no probe.

A method of manufacturing a semiconductor device, including:

• forming process of forming a semiconductor element on a semiconductor wafer, and
• testing process of testing electrical performance of said formed semiconductor element,
• said testing process including connecting process of electrically connecting a testing apparatus to an electrode pad formed on said semiconductor element to be tested,
• said connecting process electrically connecting said testing apparatus to said electrode pad, said testing apparatus having a probe-formed substrate comprising a plurality of beams having a probe to be electrically connected to said electrode pad, and a first beam for connection with said probe-formed substrate through a first supporting portion, and a second beam for connection with said substrate through a second supporting portion having a number of supporting portions more than that of said first beam.

A method of manufacturing a semiconductor device, including:

• forming process of forming a semiconductor element comprising electrode pads on a semiconductor wafer, and
• testing process of testing electrical performance of said formed semiconductor element,
• said testing process including connecting process of electrically connecting a testing apparatus to the electrode pads formed on said semiconductor element to be tested,
• said connecting process electrically connecting said testing apparatus to said electrode pads, said electrode pads being formed along sides of periphery of the semiconductor element after it is cut out of the wafer, said testing apparatus having a probe-formed substrate comprising a plurality of beams having probes to be electrically connected to the electrode pads, and a beam having probes for connection with the electrodes pads of at least two sides of said sides being supported on the probe-formed substrate by a plurality of supporting portions.