Stripper
AssigneeShipley Company, L.L.C.
InventorJavad J. Sahbari
Life of this patent
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Abstract
Compositions suitable for removing photoresist, probing ink and wafer bonding adhesive from a substrate containing one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds are provided. Such compositions show reduced metal corrosion, low toxicity and rapid removal rates of both photoresists and probing inks.
Claims19
A composition comprising one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds selected from the group consisting of benzene sulfonic acid, (C1-C20)alkylbenzene sulfonic acid, naphthalene sulfonic acid, (C1-C20)alkylnaphthalene sulfonic acid and (C7-C10)alkaryl sulfonic acid.
A composition comprising one or more (C6-C16)olefins selected from 1 -decene or 1-dodecene, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds.
A composition comprising one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds and one or more (C6-C20)aliphatic hydrocarbons.
Dependencies are inferred from the claim text.