Staged aluminum deposition process for filling vias

A process for filling a via, trench, or dual damascene structure on a substrate, comprising:

• depositing a conformal barrier/wetting layer on the substrate;
• depositing a conformal metal layer over the barrier/wetting layer at a chamber pressure less than about 1 milliTorr;
• depositing a PVD metal layer on the conformal metal layer at a temperature below about 350° C.;
• and
• reflowing the PVD metal layer.

A controller for a multi-chamber processing apparatus for performing physical vapor deposition processes, wherein the controller contains programming which, when executed, configures the controller to perform operations of forming a feature on a substrate, the operations comprising:

• depositing a barrier/wetting layer over the surfaces of an aperture in the substrate;
• physical vapor depositing a conformal first metal layer over the surface of the barrier/wetting layer without capping or filling the aperture at a chamber pressure less than about 1 milliTorr;
• and
• physical vapor depositing a second metal layer on the conformal first metal layer at a temperature below about 350° C.