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US 6,658,763 B2Granted
Method for heating and cooling substrates
AssigneeApplied Materials, Inc.
InventorsRatson Morad, Ho Seon Shin, Robin Cheung, Igor Kogan
Life of this patent
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Abstract
A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.
Claims18
A method of annealing a substrate comprising:
- providing an annealing chamber having a heating mechanism and a coolable member that is coolable by a cooling mechanism;
- loading a substrate into the annealing chamber;
- annealing the substrate by placing the substrate proximate the heating mechanism for about 15 to 180 seconds while the heating mechanism is held at a temperature of between about 150 and 600° C.;
- transferring the substrate from the position proximate the heating mechanism to a position proximate the coolable member;
- and
- cooling the substrate with the coolable member.
3 more elements
A method comprising:
- (a) providing a fabrication system having:
- a process chamber adapted to perform a deposition process on a substrate;
- a heating and cooling chamber including:
- a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism;
- a coolable member spaced from the heating mechanism and adapted to cool a substrate positioned proximate the coolable member, the coolable member being coolable by a cooling mechanism;
- and
- a transfer mechanism adapted to transfer a substrate between a position proximate the heating mechanism and a position proximate the coolable member;
- (b) performing a deposition process on a substrate within the process chamber;
- (c) transferring the substrate from the process chamber to the heating and cooling chamber;
- and
- (d) performing an annealing process on the substrate within the heating and cooling chamber by:
- heating the heating mechanism to a temperature of between about 150 and 600° C.;
- and
- placing the substrate proximate the heating mechanism for about 15 to 180 seconds.
11 more elements
Dependencies are inferred from the claim text.