US 6,656,818 B1 · Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing

Abstract

Provided is a manufacturing process for a semiconductor wafer according to which semiconductor wafers each with higher flatness can be manufactured with good efficiency from a wafer work having passed through a surface grinding step by enabling restriction of reduction in flatness in the vicinity of the center and in the outer peripheral edge portion of a surface ground wafer at the lowest level possible, and correction of the reduction in flatness of both portions with ease to planarize in a planarization or polishing step. When a semiconductor wafer fixed on a chuck table is surface ground using a cup shaped grinding wheel, the semiconductor wafer is ground toward the center thereof such that the grinding wheel cuts into the semiconductor wafer at the outer peripheral edge thereof and moves away from the semiconductor wafer at the central portion thereof and the ground semiconductor wafer is planarized according to a PACE method.

Claims9

Dependent claims

A manufacturing process for a semiconductor wafer, comprising the following steps

(a) surface grinding a semiconductor wafer fixed on a chuck table using a cup shaped grinding wheel, wherein the semiconductor wafer is ground toward the center thereof such that the cup shaped grinding wheel cuts into the semiconductor wafer at an outer peripheral edge thereof and moves away from the semiconductor wafer at a central portion thereof to obtain a around semiconductor wafer;
(b) planarizing the around semiconductor water according to a PACE method;
and
(c) polishing the product of step (b) with a CMP method;
wherein after the semiconductor wafer is ground toward the center thereof such that the cup shaped grinding wheel cuts into the semiconductor wafer at an outer peripheral edge thereof and moves away from the semiconductor wafer at a central portion thereof to obtain a ground semiconductor wafer, said ground semiconductor wafer has a concave ground surface before being planarized with the PACE method, said concave ground surface comprising a rise in an outer peripheral edge portion and a recess in a central portion.

2 more elements

Dependencies are inferred from the claim text.

Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing

Life of this patent

Manufacturing process for semiconductor wafer comprising surface grinding and planarization or polishing

Life of this patent

Abstract

Claims9