Back to results
US 6,656,645 B2Granted
Method of manufacturing a photomask
AssigneeRenesas Technology Corp.
InventorsToshihiko Tanaka, Norio Hasegawa, Tsuneo Terasawa
Life of this patent
Estimating the term…
Abstract
After a shade pattern constituted by a resist film formed on a photomask is stripped, a new shade pattern constituted by a resist film is formed on the photomask to reclaim a photomask.
Claims17
A method of manufacturing a photomask comprising the steps of:
- (a) patterning and forming a first shade portion comprised of a resist film with an integrated circuit pattern an a mask substrate;
- (b) stripping the first shade portion comprised of the resist film with an integrated circuit pattern;
- and
- (c) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern on the mask substrate from which the first shade portion comprises of the resist film with an integrated circuit pattern has been stripped.
1 more element
A method of manufacturing a photomask comprising the steps of:
- (a) patterning and forming a first shade portion comprised of a resist film with an integrated circuit pattern on a mask substrate;
- (b) inspecting the first shade portion comprised of the resist film with an integrated circuit pattern;
- (c) stripping the first shade portion comprised of the resist film with an integrated circuit pattern when the first shade portion does not pass the inspection as a result of the inspection;
- and
- (d) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern on the mask substrate from which the first shade portion comprised of the resist film with an integrated circuit pattern has been stripped.
2 more elements
A method of manufacturing a photomask comprising the steps of:
- (a) depositing a shade film comprised of a metal, on a mask substrate;
- (b) patterning and processing the shade film comprised of the metal to form a shade portion comprised of a metal in a peripheral region around an integrated circuit pattern region on the mask substrate;
- (c) patterning and forming a first;
- shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate having the shade portion comprised of the metal;
- (d) stripping the first shade portion comprised of the resist film with an integrated circuit pattern;
- and
- (e) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate from which the first shade portion comprised of the resist film with an integrated circuit pattern has been stripped.
4 more elements
A method of manufacturing a photomask comprising the steps of:
- (a) depositing a shade film comprised of a metal on a mask substrate;
- (b) patterning and processing the shade film comprised of the metal to form a shade portion comprised of a metal in a peripheral region around an integrated circuit pattern region on the mask substrate;
- (c) patterning and forming a first shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate having the shade portion comprised of the metal;
- (d) investing the first shade portion comprised of the resist film with an integrated circuit pattern;
- (e) stripping the first shade portion comprised of the resist film with an integrated circuit pattern when the first shade portion does not pass the inspection as a result of the inspection;
- and
- (f) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate from which the first shade portion comprised of the resist film with an integrated circuit pattern has been stripped.
4 more elements
A method of manufacturing a photomask comprising the steps of:
- (a) depositing a shade film comprised of a metal on a mask substrate;
- (b) patterning and processing the shade film comprised of the metal to form a first shade portion comprised of a metal in an integrated circuit pattern region on the mask substrate and to form a second shade portion comprised of a metal in a peripheral region around the integrated circuit pattern region around the integrated circuit pattern;
- (c) patterning and forming a first:
- shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate having the first and second-shade portions comprised of the metal;
- (d) stripping the first shade portion comprised of the resist film with an integrated circuit pattern;
- and
- (e) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate from which the first shade portion comprised of the resist film with an integrated circuit pattern has been stripped.
4 more elements
A method of manufacturing a photomask comprising the steps of:
- (a) depositing a shade film comprised of a metal on a mask substrate;
- (b) patterning and processing the shade film comprised of the metal to form a first shade portion comprised of a metal in an integrated circuit pattern region on the mask substrate and to form a second shade portion comprised of a metal in a peripheral region around the integrated circuit pattern region around the integrated circuit pattern;
- (c) patterning and forming a first shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern region on the mask substrate having the first and second shade portions comprised of the metal;
- (d) inspecting the first shade portion comprised of the resist film with an integrated circuit pattern;
- (e) stripping the first shade portion comprised of the resist film with an integrated circuit pattern when the first shade portion does not pass the inspection as a result of the inspection;
- and
- (f) patterning and forming a second shade portion comprised of a resist film with an integrated circuit pattern in the integrated circuit pattern on the mask substrate from which the first shade portion comprised of the resist film with an integrated circuit pattern has been stripped.
4 more elements
Dependencies are inferred from the claim text.