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US 6,656,389 B2Granted
Thermal paste for low temperature applications
AssigneeInternational Business Machines Corporation
InventorsSushumna Iruvanti, Edward Louis Yankowski, Jr.
Life of this patent
Estimating the term…
Abstract
A thermal paste for low temperature applications made from a combination of a thermally conducting solid filler, dispersant and linear alkylbenzene carrier. The thermal paste may be applied to an electronic component to increase the cooling of the electronic component.
Claims16
A thermal paste for low temperature applications comprising:
- a thermally conducting solid filler;
- a dispersant;
- and
- a linear alkylbenzene liquid carrier.
1 more element
A method for increasing the cooling of an electronic component by the use of a cooling member proximate to the electronic component comprising the step of:
- applying a thermal paste to the surface of the electronic component and the cooling member, the thermal paste comprising a thermally conducting solid filler, a dispersant, and a linear alkylbenzene liquid carrier.
Dependencies are inferred from the claim text.