Apparatus for and method of processing substrate

A substrate processing apparatus comprising:

• a substrate holder for holding a substrate;
• a developer supply nozzle including a first discharge opening having a length substantially not less than the size of a major surface of said substrate;
• a first moving mechanism for moving said developer supply nozzle from the side of a first edge of said substrate to the side of a second edge of said substrate opposite from said first edge;
• a rinsing solution supply nozzle including a second discharge opening having a length substantially not less than the size of the major surface of said substrate;
• a second moving mechanism for moving said rising solution supply nozzle from the side of said first edge of said substrate to the side of said second edge of said substrate;
• and
• a controller for causing said developer supply nozzle to move in a first moving speed pattern from the side of said first edge of said substrate to the side of said second edge of said substrate to apply a developer onto the major surface of said substrate, and then causing said rinsing solution supply nozzle to move in a second moving speed pattern from the side of said first edge of said substrate to the side of said second edge of said substrate to apply a rinsing solution onto said major surface of said substrate,
• wherein said first moving speed pattern and said second moving speed pattern are established so that developing time at different sites of said substrate decreases in proceeding from the side of said first edge to the side of said second edge.