Film forming method and film forming system

A film forming system, comprising:

• a first coating apparatus for supplying an organic coating solution to a substrate to form an organic coating film;
• a second coating apparatus for supplying an inorganic coating solution to a substrate to form an inorganic coating film;
• a first heating apparatus for vaporizing a solvent component from the applied organic coating solution;
• a second heating apparatus for performing thermal processing for the substrate from which the solvent component has been vaporized in the first heating apparatus;
• a delivery section for delivering the substrate between the first heating apparatus and the second heating apparatus;
• wherein a first area, a second area, and the inside of a processing chamber of the first heating apparatus can all be set at an atmosphere lower in oxygen than the surrounding air, the second heating apparatus and the delivery section disposed in the first area and the first heating apparatus disposed in the second area;
• the second heating apparatus is removably connectable with the first heating apparatus;
• the first area is covered with a panel as a partition to form a space, the panel is provided with a carrying in/out port through which the substrate is delivered by the delivery section between the first area and the second area, the carrying in/out port can be opened and closed by a shutter which is closed when the substrate has been delivered from the second area to the first area;
• and the processing chamber of the first heating apparatus is connected with a gas supply source and with a gas exhaust port for setting the atmosphere in the second area lower in oxygen than the surrounding air, and the panel is connected with a second gas supply source and with a second gas exhaust port for setting the atmosphere in the first area lower in oxygen than the surrounding air.