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AssigneeL'Air Liquide, Societe Anonyme a Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procedes Georges Claude
InventorsAkinobu Nasu, Jean-Marc Girard
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Provided is a copper source liquid useful in MOCVD processes for forming copper thin films on semiconductor wafers. The source liquid comprises water and a source component wherein the source component contains at least 90 weight % Cu(hfac)TMVS and the copper source liquid preferably contains no more than 10 weight % water. The dissolved oxygen concentration in the water is established at no more than 0.5 ppm relative to the water. Decomposition of the Cu(hfac)TMVS is controlled in the present invention by lowering the dissolved oxygen concentration in the water. The resulting copper source liquid allows for improved reproducibility of CVD film quality by raising the capacity to control the amount of water addition to the copper source liquid used in MOCVD processes.
A copper source liquid for MOCVD processes, which comprises a source component and water, wherein the source component contains at least 90 weight % of a substance of chemical formula (1)
A method for producing a copper source liquid for MOCVD processes, the method comprising removing the oxygen dissolved in water by mixing the water and a deoxygenating agent of chemical formula (1) (O2C5HF6)Cu.L in which L is an electrically neutral organic ligand that contains a carbon-carbon multiple bond whose p-electrons participate in coordination bonding with the monovalent copper, to form a liquid mixture and stirring the liquid mixture, after completion of stirring of the liquid mixture, the water is separated from the deoxygenating agent and recovered, and mixing the substance of chemical formula (1) and the water recovered from the liquid mixture in order to form the copper source liquid.
A method for producing a copper source liquid for MOCVD processes, the method comprising bubbling an inert gas through water in order to remove the oxygen dissolved in the water and mixing the bubbling-treated water with a substance of chemical formula (1) (O2C5HF6) Cu.L in which L is an electrically neutral organic ligand that contains a carbon-carbon multiple bond whose p-electrons participate in coordination bonding with the monovalent copper.
Dependencies are inferred from the claim text.