Apparatus and method for pick and place handling
AssigneeASM Assembly Automation Ltd.
InventorsYiu Ming Cheung, Pei Wei Tsai, Yu Sze Cheung
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Abstract
This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.
Claims48
Apparatus for handling and processing electronic components that have been separated from a common substrate at a cutting chuck, comprising:
- means for transferring said separated components from said cutting chuck to and through a processing unit, wherein said transferring means comprises at least one opening defined by a plurality of walls for receiving a plurality of said separated components, wherein at least one of said walls is movable to engage said separated components received within said opening and to hold said separated components in a fixed relative orientation.
Apparatus for the handling of electronic components formed on a common substrate, comprising:
- (a) a cutting chuck for separating said components,
- (b) a processing unit comprising a rinsing station, at least one drying station, and an output station,
- (c) a transfer platform for receiving components from said output station of said processing unit, and
- (d) an output track for carrying said components to an output location.
Apparatus for transferring a plurality of electronic components that have been separated from a common substrate, said apparatus comprising at least one opening defined by a plurality of walls for receiving a plurality of said separated components, wherein at least one of said walls is movable to engage said separated components received within said opening and to hold said separated components in a fixed relative orientation.
A method for handling and processing electronic components formed on a common substrate, comprising the steps of:
- (a) separating said components at a cutting chuck,
- (b) transferring said components by means of a transferring means to and through a processing unit,
- (c) transferring said components from an output station of said processing unit to a transfer platform, and
- (d) moving said components from said transfer platform to an output track, and
- (e) carrying said components along said output track to an output location, wherein steps (b) and (c) are carried out by a lateral sliding motion of said components over level surfaces of said cutting chuck, said processing unit and said transfer platform.
Dependencies are inferred from the claim text.