Heat dissipation device
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsCheng-Tien Lai, Tsung-Lung Lee, Shenghua Wang
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.
Claims13
A heat dissipation assembly comprising:
- a printed circuit board;
- a heat-generating electronic device mounted on the printed circuit board;
- and
- a heat dissipation device comprising a vaporizing portion attached on the electronic device, and a condensing portion connected to the vaporizing portion by a pair of separate pipes, the pipes cooperating with the vaporizing portion and the condensing portion to form a sealed circulatory route for liquid and vapor in the heat dissipation device, wherein the vapor flows from the vaporizing portion to the condensing portion and the liquid flows from the condensing portion to the vaporizing portion;
- wherein a heat conductive pad is attached on an underside of the condensing portion.
A heat dissipation assembly comprising:
- a heat-generating electronic device;
- a heat dissipation device comprising:
- a vaporizing portion contacting the heat-generating electronic device and defining a vapor outlet and liquid inlet thereof;
- a condensing portion spaced from said vaporizing portion and defining a vapor inlet and a liquid outlet thereof;
- a heat sink contacting the condensing portion;
- and
- a pair of pipe sections respectively connected between the vapor outlet and the liquid inlet, and between the vapor inlet and the liquid outlet;
- wherein
- one of said pipe sections is for liquid transmission and the other is for vapor transmission, and the vapor portion transforms liquid to vapor while the condensing portion transforms vapor to liquid;
- wherein
- said vapor outlet is higher than the liquid inlet, and said vapor inlet is higher than the liquid outlet, while the vapor outlet is substantially of the same level with the vapor inlet and the liquid outlet is substantially of the same level with the liquid inlet, thereby each of said pipe sections extending horizontally.
A heat dissipation device comprising:
- a vaporizing portion adapted for being attached to a heat-generating electronic device, said vaporzing portion containing liquid therein, wherein the liquid can be converted into vapor when it is heated by the electronic device;
- a condensing portion for receiving the vapor from the vaporizing portion and cooling the vapor into liquid;
- and
- a pair of pipes respectively engaged with the vaporizing portion and the condensing portion to form a circulatory route for the vapor from the vaporizing portion to the condensing portion and for the liquid from the condensing portion to the vaporizing portion;
- wherein a heat conductive pad is attached on an underside of the condensing portion.
Dependencies are inferred from the claim text.