Piezoelectric actuated jet impingement cooling
AssigneeIntel Corporation
InventorsGregory M. Chrysler, James G. Maveety
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AssigneeIntel Corporation
InventorsGregory M. Chrysler, James G. Maveety
Estimating the term…
Embodiments in accordance with the present invention provides active thermal management of the heat generated at localized hot spots on the microelectronic die by using fluid impingement cooling. The combination of orifices constructed using piezoelectric microelectromechanical systems (MEMs) technology, fluid impingement for maximizing the heat transfer coefficient, and embedded thermal diodes within the microelectronic die for measuring local temperature, to produce an active, closed-loop flow-control system for managing hot spots. A small reservoir of fluid is stationed a small distance above the die. The base of the reservoir has an array of piezoelectric orifices embedded within it, and positioned over the hotspot(s). The piezoelectric orifices can be opened and closed depending on the voltage applied.
A thermal management device comprising:
A method for thermal management of one or more heat producing components comprising:
A microelectronic assembly comprising:
Dependencies are inferred from the claim text.