Measurement chuck having piezoelectric elements and method
AssigneeMotorola, Inc.
InventorsKarl Mautz, John Maltabes, Alain Charles
Life of this patent
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Abstract
A metrology and probe chuck (100) holds a flat object (150), such as a semiconductor wafer (150) at the backside (152). The chuck has, supported on a base plate (105), a plurality of pins (110-n) to receive partial forces (Fn) from the backside (152) and a plurality of piezoelectric elements (120-n) attached to the pins to sense the partial forces (Fn) applied from the object (150) to the pins (110-n). The piezoelectric elements (120-n) apply partial displacements (Bn) of the pins (110-n) to act on selected areas of the object (150) and thereby compensate for irregularities in the backside contour.
Claims17
An apparatus, comprising:
- a measurement chuck to hold a flat object at the backside, said chuck comprising:
- a base plate;
- a plurality of pins standing vertically on said base plate to receive partial forces from said backside of said object;
- and
- a plurality of piezoelectric elements attached to said pins to sense the partial forces applied from said object to said pins;
- and
- a metrology tool over the chuck.
A wafer measuring apparatus, comprising:
- a measuring chamber;
- and
- a measurement chuck, said chuck to hold a wafer at the backside, wherein said chuck comprises:
- a base plate;
- a plurality of pins standing vertically on said base plate to receive partial forces from said backside of said wafer;
- and
- a plurality of piezoelectric elements attached to said pins to sense different partial forces resulting from irregularities of said backside and to partially apply compensating displacements of said pins in response to said sensed partial forces;
- and
- a metrology tool over the chuck.
Dependencies are inferred from the claim text.