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US 6,649,986 B1Granted
Semiconductor device with structure for die or dice crack detection
AssigneeOki Electric Industry Co., Ltd.
InventorsTakashi Ishizaki, Takashi Tamaki
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Abstract
To provide a semiconductor device that has a structure for detecting dice cracks that occur in semiconductor chips. The semiconductor device structure according to the present invention makes it possible to detect electrically only the dice cracks that cause a loss of functionality of the semiconductor chip, doing so at the same time as the electrical characteristic tests that are performed after the fabrication of the semiconductor device.
Claims9
A semiconductor device comprising;
- a semiconductor chip that has a central region, a peripheral region encompassing said central region, a plurality of active regions fabricated in said central region and said peripheral region, and a field region encompassing said active regions;
- a plurality of electrode pads fabricated in said peripheral region;
- a first die crack detection interconnection for detecting die cracks, that is fabricated in said peripheral region so as to surround said central region, and fabricated above said field region in the vicinity of a boundary surface or interface between said active region and said field region;
- and
- a second die crack detection interconnection for detecting die cracks, that is fabricated in said peripheral region so as to surround said central region, and fabricated under said field region in the vicinity of the boundary surface between said active region and said field region.
2 more elements
Dependencies are inferred from the claim text.