Method of laser drilling

A method of laser drilling of an electrical circuit substrate, comprising:

• directing a laser beam onto a portion of the substrate to be drilled;
• and moving the laser beam in a region of a hole to be drilled on a circular path, a center point of the region lying concentrically with respect to a set position of the hole to be drilled and a diameter of the region being at most equal to a diameter of the hole, wherein the diameter of the laser beam always covers the center point of the hole during the circular motion of the laser beam, wherein a circle diameter of the circular path corresponds at least to one eighth of the hole diameter and at most to the hole diameter.

A method of laser drilling of an electrical circuit substrate, comprising:

• directing a laser beam onto a portion of the substrate to be drilled;
• and moving the laser beam in a region of a hole to be drilled on a circular path, a center point of the region lying concentrically with respect to a set position of the hole to be drilled and a diameter of the region being at most equal to a diameter of the hole, wherein the diameter of the laser beam always covers the center point of the hole during the circular motion of the laser beam, wherein the spot diameter of the laser beam is at least one of greater than the hole diameter by up to 20% and smaller than the hole diameter by up to 20%.

A method of laser drilling of an electrical circuit substrate, comprising:

• directing a laser beam onto a portion of the substrate to be drilled;
• and moving the laser beam in a region of a hole to be drilled on a circular path, a center point of the region lying concentrically with respect to a set position of the hole to be drilled and a diameter of the region being at most equal to a diameter of the hole, wherein the diameter of the laser beam always covers the center point of the hole during the circular motion of the laser beam, wherein the spot diameter of the laser beam is at least one of greater than the hole diameter by up to 10% and smaller than the hole diameter by up to 10%.

A method of laser drilling of an electrical circuit substrate, comprising:

• directing a laser beam onto a portion of the substrate to be drilled;
• and moving the laser beam in a region of a hole to be drilled on a circular path, a center point of the region lying concentrically with respect to a set position of the hole to be drilled and a diameter of the region being at most equal to a diameter of the hole, wherein the diameter of the laser beam always covers the center point of the hole during the circular motion of the laser beam, wherein the laser beam is directed onto a portion of the substrate to be drilled through a perforated mask, proximate to the substrate surface and including a predetermined hole diameter, wherein the laser beam is moved in the region of a respective hole in the perforated mask on a circular path, the center point of which lies concentrically with respect to the set position of the hole respectively to be drilled, and the diameter of which is at most equal to the diameter of the hole, wherein the laser beam is produced by a CO2 laser, and wherein the laser includes a repetition frequency of at least 20 kHz.