Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structures

In an integrated circuit including a first interconnection coupled to a transistor, a method of forming a second interconnection comprising:

• depositing a masking material over the first interconnection;
• depositing a dielectric material over the masking material;
• forming a via through the dielectric material to expose the masking material;
• depositing a first photoimageable material in a portion of the via over the exposed masking material such that the via is partially filled with the first photoimageable material;
• after depositing said first photoimageable material depositing a second photoimageable material and patterning said second photoimageable material over the dielectric material defining an area for a trench
• after patterning the second photoimageable material, forming a trench in the dielectric material over a portion of the via;
• removing the photoimageable material from the via;
• extending the via through the masking material;
• and
• depositing a conductive material in the via.

A damascene method comprising:

• depositing a masking material over a conductive interconnection of an integrated circuit substrate;
• depositing a dielectric material over the masking material;
• forming a via through the dielectric material to expose the masking material;
• depositing a first photoimageable material in a portion of the via over the exposed masking material such that the via is partially filled with the first photoimageable material;
• patterning a second photoimageable material over the dielectric material defining an area for a trench;
• after patterning the second photoimageable material, forming a trench in the dielectric material over a portion of the via;
• removing the first photoimageable material from the via;
• extending the via through the masking material;
• and depositing a conductive material in the via, wherein the first photoimageable material and the second photoimageable material have different compositions.