Aligning method, exposure apparatus using this aligning method, and semiconductor device manufacturing method utilizing this exposure apparatus
AssigneeCanon Kabushiki Kaisha
InventorYoshinori Ohsaki
Life of this patent
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Abstract
A method of measuring a position of a mark in a measurement direction. The method includes a detecting step of detecting a change in information regarding the position of the mark in the measurement direction by moving the mark in another direction different from the measurement direction, a selecting step of selecting a measurement condition on the basis of the change in the information, and a measuring step of measuring the position of the mark with the measurement condition selected in the selecting step.
Claims20
A method of measuring a position of a mark in a measurement direction, said method comprising:
- a detecting step of detecting a change in information regarding the position of the mark in the measurement direction by moving the mark in another direction different from the measurement direction;
- a selecting step of selecting a measurement condition on the basis of the change in the information;
- and
- a measuring step of measuring the position of the mark with the measurement condition selected in said selecting step.
A method of aligning the position of a substrate, by measuring a position of a mark selected from a plurality of marks formed on the substrate, said method comprising:
- a detecting step of detecting a change in information regarding a position of a mark in a measurement direction by moving the mark in another direction different from the measurement direction;
- a selecting step of selecting a mark on the basis of the change in the information;
- and
- a measuring step of measuring the position of the mark selected in said selecting step.
A method of evaluating a mark, in which a position of the mark is to be measured in a measurement direction, said method comprising the steps of:
- obtaining information regarding a position of the mark in the measurement direction;
- detecting a change in information regarding a position of the mark in a measurement direction by moving the mark in another direction different from the measurement direction;
- and
- evaluating the mark on the basis of the change in the information.
An exposure apparatus for exposing a pattern of an original onto a substrate, said apparatus comprising:
- an alignment system for aligning a position of the substrate by measuring a position of a mark selected from a plurality of marks formed on the substrate, said alignment system comprising:
- (i) detecting means for detecting a change in information regarding a position of the mark in a measurement direction by moving the mark in another direction different from the measurement direction;
- (ii) selecting means for selecting a mark on the basis of the change in the information, and
- (iii) measuring means for measuring the position of the mark selected by said selecting means.
A device manufacturing method of manufacturing a semiconductor device, said method comprising the steps of:
- coating a substrate with a resist;
- drawing a pattern on the substrate by using an exposure apparatus for exposing a pattern of an original onto the substrate;
- and
- developing the substrate,
- wherein the exposure apparatus includes:
- an alignment system for aligning a position of the substrate by measuring a position of a mark selected from a plurality of marks formed on the substrate, wherein the alignment system further comprises:
- (i) detecting means for detecting a change in information regarding a position of the mark in a measurement direction by moving the mark in another direction different from the measurement direction,
- (ii) selecting means for selecting a mark on the basis of the change in the information, and
- (iii) measuring means for measuring the position of the mark selected by the selecting means.
Dependencies are inferred from the claim text.