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US 6,649,450 B2Granted
Method of producing an integrated circuit and an integrated circuit
AssigneeInfineon Technologies AG
InventorsGeorg Ernst, Horst Gröninger, Thomas Zeiler
Life of this patent
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Abstract
A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.
Claims5
A method of producing an integrated circuit, which comprises the steps of:
- providing a leadframe having at least one leadframe section, the leadframe section carrying a semiconductor component surrounded by a plastic housing, the leadframe section having conductor tracks passing through an outer surface of the plastic housing;
- subjecting at least one transition area between the plastic housing and the conductor tracks to high-energy radiation for removing parts at side edges of the plastic housing in the transition area, producing a smooth side surface of the plastic housing extending between the conductor tracks;
- and
- cutting the conductor tracks in the vicinity of the side edges of the plastic housing, thereby producing a dividing surface of the conductor tracks and producing a spacing of 1 to 5 μm between the dividing surface and the side surface of the plastic housing surrounding the dividing surface.
1 more element
Dependencies are inferred from the claim text.