US 6,648,062 B2 · Heat sink-type cooling device

Abstract

A heat sink-type cooling device is provided which can enhance the amount of heat dissipated without increasing the size of the fins, and which is miniaturized and has high cooling capacity. A heat sink-type cooling device comprises a heat sink that is provided with a passage through which coolant flows, and that removes heat from electronic devices contacting with the upper surface of the heat sink. Fin groups are provided in the passage, each of which is comprised of a plurality of fins that are disposed in parallel with the direction of the coolant flow and are aligned in the thickness direction thereof. Fins of a fin group and other fins of another fin group adjoining the fin group in the direction of the flow are placed at a distance in the thickness direction of the fins.

Claims5

Dependent claims

A heat sink-type cooling device comprising:

a heat sink which is provided with a passage through which coolant flows, and a plurality of discrete fin groups being relocatable within the passage, each fin group being comprised of a plurality of fins that are disposed in parallel with a direction of the flow,
wherein the heat sink removes heat from a heat source which contacts with a surface of the heat sink, and the fin groups are arranged discretely in the direction of the flow to obtain increased performance by relocating the fin groups, and a fin of a fin group and another fin of another fin group adjoining to the fin group in the direction of the flow are arranged at an offset distance in the thickness direction of the fins, and adjoining fin groups contact with each other in the direction of the flow.

Dependencies are inferred from the claim text.

Heat sink-type cooling device

Life of this patent

Heat sink-type cooling device

Life of this patent

Abstract

Claims5