Device for contactlessly gripping and positioning components
AssigneeTechnische Universität München
InventorsJürgen Höppner, Josef Zimmerman
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Abstract
A mechanism for the contactless gripping and positioning of a component having a planar peripheral edge region, including a sound producing device producing a pattern of levitation sound waves for keeping the component in suspension at a selected position. The sound producing device is configured wherein only the peripheral edge region of the component lies in the sound wave pattern to be acted upon thereby and is fixed in the sound wave pattern by Bernoulli forces. The total surface area of the sound producing device is less than the component's total surface area facing the sound producing device.
Claims4
Apparatus for the contactless gripping and positioning of a component having a planar peripheral edge region, the apparatus comprising a sound producing mechanism producing a pattern of levitation sound waves for keeping the component in suspension at a selected position, the sound producing mechanism configured wherein only the peripheral edge region of the component lies in the sound wave pattern to be acted upon thereby and is fixed in the sound wave pattern by Bernoulli forces;
- wherein a total surface area of the sound producing mechanism is less than the component's total surface area facing the sound producing mechanism.
Dependencies are inferred from the claim text.