Liquid processing apparatus and method
AssigneeTokyo Electron Limited
InventorsYuji Kamikawa, Taichi Sakaguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsYuji Kamikawa, Taichi Sakaguchi
Estimating the term…
A cleaning processing apparatus and method of wafers W held by a rotor capable of holding a plurality of wafers W, which is one embodiment of the liquid processing apparatus of the present invention, comprises an outside chamber, an inside chamber arranged slidable between a process position and a retreat position, and a cleaning mechanism for cleaning the inside chamber in the retreat position. The cleaning mechanism includes a cylindrical body arranged in the inside chamber so as to form a substantially cylindrical cleaning processing space between the inside chamber and the cylindrical body, a cleaning liquid spurting nozzle for spurting a cleaning liquid into the cleaning processing space, and a gas supply nozzle for supplying a predetermined drying gas into the cleaning processing space so as to make it possible to clean and dry the inside chamber.
A liquid processing apparatus for performing a liquid processing by supplying a process liquid to a plurality of substrates, comprising:
A liquid processing method for performing a liquid processing by supplying a process liquid to the substrates held by a rotor capable of holding a plurality of substrates a predetermined distance apart from each other by using a liquid processing apparatus including:
A liquid processing apparatus for performing a liquid processing by supplying a process liquid to the substrate, comprising:
Dependencies are inferred from the claim text.