Temperature control of an integrated circuit
AssigneeAdvanced Micro Devices, Inc.
InventorsJohn Yi, Fu-Weng Tea
Life of this patent
Estimating the term…
Abstract
An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrated circuit, is covered by a block of thermally conductive material of predetermined thickness T, where T is a function of a desired temperature profile and, optionally, the current drawn by the microprocessor undergoing testing.
Claims20
An apparatus for temperature control of an integrated circuit comprising:
- a socket for receiving the integrated circuit and passing a set of instructions to the integrated circuit;
- and
- a thermally conductive block of thickness T overlying and in thermal contract with the integrated circuit, where thickness T is a function of a desired temperature profile of the integrated circuit, such that heat may transfer from the integrated circuit to the thermally conductive block in order to provide a desirable temperature profile of the integrated circuit.
An apparatus for temperature control of an integrated circuit undergoing pre-delivery testing, comprising:
- a testing package for receiving the integrated circuit and passing a set of testing instructions to the integrated circuit, the testing package including a thermally conductive lid overlying and in thermal contact with the integrated circuit;
- and
- a thermally conductive block of thickness T overlying and in thermal contact with the thermally conductive lid, where thickness T is a function of a desired temperature profile of the integrated circuit.
A method for controlling the temperature of an integrated circuit, said method comprising the steps of:
- placing the integrated circuit in a socket;
- selecting a thermally conductive block of thickness T, where thickness T is a function of a desired temperature profile of the integrated circuit;
- placing the thermally conductive block in thermal contact with the integrated circuit;
- and
- passing a set of testing instructions to the integrated circuit such that a temperature of the integrated circuit substantially conforms to a desired temperature profile.
A method for controlling the temperature of an integrated circuit undergoing pre-delivery testing, said method comprising the steps of:
- placing the integrated circuit in a testing package, the testing package including a thermally conductive lid,
- placing the thermally conductive lid in thermal contact with the integrated circuit;
- selecting a thermally conductive block of thickness T, where thickness T is a function an initial temperature of the integrated circuit;
- placing the thermally conductive block in thermal contact with the thermally conductive lid;
- and
- passing a set of testing instructions to the integrated circuit such that a temperature of the integrated circuit during testing substantially conforms to a desired testing temperature profile.
Dependencies are inferred from the claim text.