Electronic component mounting method and mounting apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHiroyuki Sakaguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHiroyuki Sakaguchi
Estimating the term…
The substrate recognition time is shortened, and the productivity is enhanced. This is an electronic component mounting method for mounting a plurality of electronic components on a substrate by using a plurality of moving tables. Each moving table of the plurality of moving tables has a mounting head for picking up and transferring each electronic component, and a camera for recognizing the substrate. The mounting method includes the steps of (a) taking a calibration substrate having a reference mark for position calibration by the camera, and obtaining a position calibration data intrinsic to each moving table having the camera, (b) taking the substrate by only one of the cameras prior to mounting of each electronic component, and recognizing the position of the substrate, and (c) picking up each electronic component by each mounting head, and mounting the electronic component on the substrate. The step of mounting each electronic component on the substrate includes a step of controlling the position of the moving table on the basis of the substrate position recognition result and the position calibration data.
An electronic component mounting method comprising the steps of:
An electronic component mounting method for mounting a plurality of electronic components on a substrate by using a plurality of moving tables, said plurality of moving tables installed on a base, each moving table of said plurality of moving tables including a mounting head for picking up and transferring each electronic component;
An electronic component mounting apparatus comprising:
Dependencies are inferred from the claim text.