Multiple image reticle for forming layers
AssigneeMicron Technology, Inc.
InventorChristophe Pierrat
Life of this patent
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Abstract
A multi-image reticle used to form integrated circuitry comprises a two dimensional array of spaced images arranged in a matrix of controllably spaced rows and columns of images on a single reticle. No rotation of the reticle is required to expose various levels of circuitry on a semiconductor wafer. The wafer is held in a stepper device, which controllably positions the wafer under the desired image of the mask for exposure of a resist on the wafer. A movable aperture controls exposure through a selected image or mask pattern on the reticle. By controlling which image is used, and accurately positioning the wafer via the stepper, multiple images are accurately registered, leading to improvement in dimensions of circuitry and other structures formed on the wafer.
Claims33
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle;
- positioning a plurality of integrated-circuit mask patterns in different areas of the reticle, at least some of the mask patterns representing different entire layers of the single integrated circuit;
- projecting radiation onto a first of the mask patterns to expose the die with a first of the masks on the reticle;
- moving at least one of the die and the reticle relative to each other in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the same die with a second of the mask patterns on the reticle;
- fabricating at least one circuit layer on the substrate.
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle;
- positioning a plurality of integrated-circuit mask patterns in different areas of the reticle,
- projecting radiation onto a first of the mask patterns to expose the entire area of the die with a first of the mask patterns on the reticle;
- processing the substrate in response to the first of the mask patterns;
- after processing, moving at least one of the die and the reticle relative to each other in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the entire area of the same die with a second of the mask patterns on the reticle.
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle having a plurality of integrated-circuit mask patterns in different areas;
- projecting radiation onto a first of the mask patterns to expose the entire area of the die with a first of the mask patterns on the reticle;
- processing the substrate in response to the first of the mask patterns;
- after processing, moving at least one of the die and the reticle relative to each other in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the entire area of the same die with a different one of the mask patterns on the reticle.
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle having in different areas thereof a plurality of integrated-circuit mask patterns oriented in the same direction;
- projecting radiation onto a first of the mask patterns to expose the entire area of the die with a first of the mask patterns on the reticle;
- processing the substrate in response to the first of the mask patterns;
- after processing, moving at least one of the die and the reticle relative to each other in one of two mutually orthogonal directions without rotation;
- projecting radiation onto a second of the mask patterns to expose the entire area of the same die with a different one of the mask patterns on the reticle.
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle;
- positioning a plurality of integrated-circuit mask patterns in different areas of the reticle;
- projecting radiation onto a first of the mask patterns to expose the entire area of the die with a first of the mask patterns on the reticle;
- processing the substrate in response to the first of the mask patterns;
- after processing, moving at least one of the die and the reticle relative to each other in one of two directions without rotation;
- projecting radiation onto a second of the mask patterns to expose the entire area of the same die with a different one of the mask patterns on the reticle.
A method of fabricating integrated circuits on a substrate, comprising:
- fabricating a reticle containing in different areas thereof a plurality of mask patterns for a die representing one of the integrated circuits;
- projecting radiation onto a first of the mask patterns to expose the entire area of the die with a first of the mask patterns on the reticle;
- processing the substrate in response to the first of the mask patterns;
- after processing, moving at least one of the die and the reticle relative to each other in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the entire area of the same die with a different one of the mask patterns on the reticle.
A method of fabricating integrated circuits on a substrate, comprising:
- fabricating a reticle containing in different areas thereof a plurality of mask patterns, at least some of the mask patterns representing multiple entire layers of a die for one of the integrated circuits;
- projecting radiation onto a first of the mask patterns to expose the die with a first of the mask patterns on the reticle;
- effecting relative motion between the die and the mask patterns in the reticle in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the same die with a different one of the mask patterns on the reticle;
- processing the substrate between exposing the first and the second of the mask patterns.
A method of forming a die for a single integrated circuit on a substrate, comprising:
- fabricating a reticle;
- positioning a plurality of integrated-circuit mask patterns in different areas of the reticle, at least some of the mask patterns representing different entire layers of the single integrated circuit;
- projecting radiation onto a first of the mask patterns to expose the die with a first of the mask patterns on the reticle;
- effecting relative motion between the die and the mask patterns in the reticle in a straight line without rotation;
- projecting radiation onto a second of the mask patterns to expose the same die with a second of the mask patterns on the reticle;
- processing the substrate between exposing the first and the second mask patterns.
Dependencies are inferred from the claim text.