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US 6,646,475 B2Granted
On-chip power supply with optimized electromagnetic compatibility
AssigneeInfineon Technologies AG
InventorThomas Steinecke
Life of this patent
Estimating the term…
Abstract
The integrated circuit is implemented on a chip. The circuit has several modules, common power supply pins for the modules, and a capacitive buffer devices that buffer the current supply. The capacitive buffers are assigned to each module.
Claims4
An integrated circuit formed on a chip, comprising:
- a plurality of modules disposed on the chip;
- common power supply terminals connected to said modules;
- power supply tracks extending from said power supply terminals to supply terminals of said modules, and extending around said modules in an annular shape;
- and
- capacitive buffers for buffering the power supply associated with each one of said modules, said capacitive buffers being integrated into said power supply tracks and having a capacitance set to cover a dynamic current demand of said modules.
2 more elements
Dependencies are inferred from the claim text.