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US 6,646,341 B2Granted
Heat sink apparatus utilizing the heat sink shroud to dissipate heat
AssigneeHewelett-Packard Development Company, L.P.
InventorsHarold Miyamura, Christopher G. Malone
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Abstract
In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.
Claims26
A heat sink apparatus comprising:
- a heat sink device comprising a heat pipe thermally coupled with a heat source and for transferring heat from said heat source;
- and
- a heat sink shroud at least partially enclosing said heat source and thermally coupled with said heat sink device, said heat sink shroud for transferring said heat from said heat sink device and for dissipating said heat.
A method for dissipating heat comprising:
- transferring heat from a heat source using a heat sink device comprising a heat pipe;
- and
- transferring said heat from said heat sink-device to a heat sink shroud at least partially enclosing said heat source and thermally coupled with said heat sink device, wherein said heat sink shroud facilitates dissipating said heat.
A heat dissipation system comprising:
- heat transferring means for transferring heat from a heat source coupled with a substrate;
- and
- means for coupling said heat transferring means to said substrate, wherein said means for coupling said heat transferring means to said substrate at least partially encloses said heat source and is thermally coupled with said heat transferring means, and wherein said means for coupling said heat transferring means to said substrate dissipates heat from said heat source.
Dependencies are inferred from the claim text.