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US 6,646,336 B1Granted
Wearable silicon chip
OwnerGeorge Marmaropoulos, Clive R. Van Heerdeninventors
Life of this patent
Estimating the term…
Abstract
A semiconductor chip package and method of providing same including a semiconductor die, an insulating package body encapsulating the semiconductor die, and an aperture extending through and between opposing sides of the package body, wherein at least a portion of an inner surface of the aperture is electrically connected to the semiconductor die.
Claims17
A semiconductor chip package comprising:
- a semiconductor die;
- an insulating package body encapsulating said semiconductor die;
- and
- an aperture extending through and between opposing sides of said insulating package body, wherein at least a portion of an inner surface of said aperture is conductive, electrically connected to said semiconductor die, and electrically cooperative with one or more conductive threads.
1 more element
A method of packaging a semiconductor chip comprising:
- encapsulating a semiconductor die in a insulating package body;
- forming an aperture passing through and between opposing sides of said package body, said aperture having one or more conductive portions electrically cooperative with one or more conductive threads;
- and
- electrically connecting at least one of said one or more conductive portions to said semiconductor die.
1 more element
A semiconductor chip package comprising:
- at least one semiconductor die;
- at least one insulating body encapsulating said at least one semiconductor die;
- and
- two or more apertures extending through and between opposing sides of said at least one insulating body, wherein at least a portion of an inner surface of at least one of said two or more apertures is conductive, electrically connected to said at least one semiconductor die, and electrically cooperative with one or more conductive threads.
1 more element
Dependencies are inferred from the claim text.