Integrated circuit configuration having at least two capacitors and method for manufacturing an integrated circuit configuration
AssigneeInfineon Technologies AG
InventorsJosef Willer, Christofer Hierold
Life of this patent
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Abstract
A first capacitor electrode and at least part of a second capacitor electrode of a capacitor are produced in depressions of an auxiliary layer by electroplating. The auxiliary layer is then removed and at least partially replaced by a capacitor dielectric. The first capacitor electrode and the part of the second capacitor electrode may be composed of a metal, for example platinum. The capacitor dielectric can be composed, for example, of barium-strontium-titanate.
Claims12
An integrated circuit configuration, comprising:
- a substrate having a surface;
- at least two capacitors provided on said surface of said substrate;
- each of said capacitors having a first capacitor electrode, a second capacitor electrode, and a capacitor dielectric;
- said first capacitor electrode and at least a given part of said second capacitor electrode having respective lateral faces, said first capacitor electrode and said second capacitor electrode being disposed such that only said respective lateral faces of said first capacitor electrode and of at least said given part of said second capacitor electrode are disposed opposite one another;
- said first capacitor electrode and said given part of said second capacitor electrode being composed of a material that is hard to etch;
- said capacitor dielectric being composed of a perovakite and being disposed between said lateral faces of said first capacitor electrode and of said given part of said second capacitor electrode disposed opposite one another;
- said first capacitor electrode being substantially composed of a given metal, said second capacitor electrode being configured such that only said given part of said second capacitor electrode is substantially composed of said given metal;
- an adhesive layer being composed of at least of one material selected from the group consisting of ruthenium, iridium, molybdenum, a ruthenium oxide, an iridium oxide, a molybdenum oxide, Tantalum and TaN, said adhesive layer having a first part and a second part;
- said first capacitor electrode being disposed on said first part of said adhesive layer and said second capacitor electrode being disposed on said second part of said adhesive layer;
- and
- said given part of said second capacitor electrode of a first one of said at least two capacitors being coherent with said given part of said second capacitor electrode of a second one of said at least two capacitors.
A method for producing an integrated circuit configuration including at least two capacitors, the method which comprises:
- applying an adhesive layer on a substrate, the adhesive layer being composed of at least of material selected from the group consisting of ruthenium, iridium, molybdenum, a ruthenium oxide, an iridium oxide, a molybdenum oxide, Tantalum and TaN;
- subsequently applying an auxiliary layer on the substrate;
- forming at least one first depression and at least one second depression in the auxiliary layer such that the first depression and the second depression extend as far as the adhesive layer;
- producing, with an electroplating process, a first capacitor electrode in the first depression on a first part of the adhesive layer, and at least a given part of a second capacitor electrode in the second depression on a second part of the adhesive layer, the first capacitor electrode and at least the given part of the second capacitor electrode having respective lateral faces, the first capacitor electrode and the second capacitor electrode being disposed such that only the respective lateral faces of the first capacitor electrode and of at least the given part of the second capacitor electrode are disposed opposite one another, the first capacitor electrode and the given part of the second capacitor electrode being composed of a material being hard to etch, the first capacitor electrode being substantially composed of a given metal, the second capacitor electrode being configured such that only given part of the second capacitor electrode is substantially composed of the given metal, the given part of the second capacitor electrode of a first one of the at least two capacitors being coherent with the given part of the second capacitor electrode of a second one of the at least two capacitors;
- removing the auxiliary layer;
- subsequent to removing the auxiliary layer, removing parts of the adhesive layer, which have been exposed by removing the auxiliary layer, by an anisotropic etching step;
- and
- producing a capacitor dielectric between the lateral faces of the first capacitor electrode and the given part of the second capacitor electrode, the capacitor dielectric being composed of a perovskite.
Dependencies are inferred from the claim text.