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US 6,646,236 B1Granted
Hot plate unit
AssigneeIbiden Co., Ltd.
InventorsJo Saito, Masakazu Furukawa, Yasutaka Ito
Life of this patent
Estimating the term…
Abstract
A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.
Claims8
A hot plate unit comprising:
- a case having a lip;
- a hot plate having a heat generator, wherein the case and the hot plate define a space in which a fluid flows;
- and
- a heat insulative seal element located between the lip and the periphery of a lower surface of the hot plate;
- wherein the seal element includes a heat insulative seal ring secured on the lip by a fastener;
- and
- wherein a step is formed at inner edge of the seal ring for supporting the hot plate.
4 more elements
A hot plate unit comprising:
- a case having a lip;
- a hot plate having a heat generator;
- at least one intake port extending though the case;
- and
- a heat insulative seal element located between the lip and a peripheral portion of the lower surface of the hot plate,
- wherein the seal element includes a heat insulative seal ring secured on the lip by a fastener;
- and
- wherein a step is formed at an inner edge of the seal ring for supporting the hot plate.
5 more elements
Dependencies are inferred from the claim text.