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AssigneeHitachi High-Technologies Corporation
InventorsSeiichiro Kanno, Ken Yoshioka, Ryoji Nishio, Saburou Kanai, Hideki Kihara, Koji Okuda
Estimating the term…
A wafer stage for use in wafer processing apparatus which comprises a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate that is attached onto the liquid cooling jacket and has therein a heater and an electrode for electrostatic chuck use, the wafer stage performing wafer processing while letting a wafer be mounted on the ceramic plate, wherein the liquid cooling jacket permits attachment of the ceramic plate through a coolant gas circulating gap as formed over the liquid cooling jacket while disposing between the liquid cooling jacket and the ceramic plate more than one heat resistant seal material containing therein an elastic body for sealing the coolant gas.
A wafer stage for use in a wafer processing apparatus comprising a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto said liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck, said wafer stage being for performing wafer processing while letting a wafer be mounted on the ceramic plate,
A wafer stage for use in a wafer processing apparatus comprising a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto said liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck, said wafer stage being for performing wafer processing while letting a wafer be mounted on the ceramic plate,
Dependencies are inferred from the claim text.