Method for fabricating an integrated semiconductor product
AssigneeInfineon Technologies AG
InventorJoachim Hoepfner
Life of this patent
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Abstract
A method fabricates an integrated semiconductor product. The first step is providing a semiconductor wafer that has preformed semiconductor components. The next step is forming at least one connection, in particular a polysilicon connection. The next step is exposing the at least one connection from the wafer front surface. The next step is applying a protective layer, in particular a silicon nitride protective layer, to the wafer front surface. The next step is treating the wafer front surface by a chemical mechanical polishing (CMP) step, with the result that the at least one connection is made accessible again.
Claims23
A method for fabricating an integrated semiconductor product, which comprises:
- providing a semiconductor wafer with preformed semiconductor components and a front surface;
- forming a connection on the wafer;
- exposing the connection on the wafer front surface;
- applying a protective layer to the wafer front surface;
- and
- chemical mechanical polishing the wafer front surface to make the connection accessible.
Dependencies are inferred from the claim text.