Method and apparatus for combining integrated and offline metrology for process control

A method, comprising:

• performing a process operation on a first semiconductor wafer within a first lot of semiconductor wafers using a processing tool;
• acquiring integrated metrology data from said first semiconductor wafer, said integrated metrology data comprising inline metrology data acquired using an integrated metrology tool being integrated within said processing tool;
• performing a dynamic time process control based upon said integrated metrology data, said dynamic time process control comprising a wafer-to-wafer feedback loop;
• processing a second semiconductor wafer within said first lot based upon said dynamic time process;
• acquiring offline metrology data from at least one of said first semiconductor wafer and said second semiconductor wafer from said first lot;
• and
• performing a constant time process control based upon said offline metrology data and said integrated metrology data, said constant time process control comprising performing a lot-to-lot feedback process for a second lot of semiconductor wafers.