Pattern formation material and pattern formation method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShinji Kishimura, Masayuki Endo, Masaru Sasago, Masamitsu Shirai, Masahiro Tsunooka
Life of this patent
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Abstract
A pattern formation material of this invention contains a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator: wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom; and R7 is a protecting group released by an acid.
Claims20
A pattern formation material comprising:
- a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2;
- and an acid generator;
- wherein R1 and R2 are the same or different and selected from the group consisting of a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom;
- and R7 is a protecting group released by an acid.
A pattern formation material comprising:
- a polymer including a first unit represented by Chemical Formula 3, a second unit represented by Chemical Formula 4 and a third unit represented by Chemical Formula 5;
- and
- an acid generator:
- wherein R1, R2 and R8 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5, R6, R9, R10, R11 and R12 are a hydrogen atom or a fluorine atom, at least one of R3, R4, R5 and R6 being a fluorine atom;
- and R7 is a protecting group released by an acid.
A pattern formation material comprising:
- a polymer including a first unit represented by Chemical Formula 6, a second unit represented by Chemical Formula 7 and a third unit represented by Chemical Formula 8;
- and
- an acid generator:
- wherein R1, R2 and R13 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom;
- and R7 is a protecting group released by an acid.
A pattern formation material comprising:
- a polymer including a first unit represented by Chemical Formula 9, a second unit represented by Chemical Formula 10 and a third unit represented by Chemical Formula 11;
- and
- an acid generator:
- wherein R1, R8 and R14 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R9, R10, R11 and R12 are a hydrogen atom or a fluorine atom;
- and R15 is a protecting group released by an acid.
A pattern formation method comprising the steps of:
- forming a resist film by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator:
- wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom;
- and R7 is a protecting group released by an acid;
- irradiating said resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure;
- and
- forming a resist pattern by developing said resist film after the pattern exposure.
A pattern formation method comprising the steps of:
- forming a resist film by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 3, a second unit represented by Chemical Formula 4 and a third unit represented by Chemical Formula 5, and an acid generator:
- wherein R1, R2 and R8 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5, R6, R9, R10, R11 and R12 are a hydrogen atom or a fluorine atom, at least one of R3, R4, R5 and R6 being a fluorine atom;
- and R7 is a protecting group released by an acid;
- irradiating said resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure;
- and
- forming a resist pattern by developing said resist film after the pattern exposure.
A pattern formation method comprising the steps of:
- forming a resist film by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 6, a second unit represented by Chemical Formula 7 and a third unit represented by Chemical Formula 8, and an acid generator:
- wherein R1, R2 and R13 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom;
- and R7 is a protecting group released by an acid;
- irradiating said resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure;
- and
- forming a resist pattern by developing said resist film after the pattern exposure.
A pattern formation method comprising the steps of:
- forming a resist film by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 9, a second unit represented by Chemical Formula 10 and a third unit represented by Chemical Formula 11, and an acid generator:
- wherein R1, R8 and R14 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom;
- R9, R10, R11 and R12 are a hydrogen atom or a fluorine atom;
- and R15 is a protecting group released by an acid;
- irradiating said resist film with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure;
- and
- forming a resist pattern by developing said resist film after the pattern exposure.
Dependencies are inferred from the claim text.