Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
AssigneeAtotech Deutschland GmbH
InventorNayan H. Joshi
Life of this patent
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Abstract
A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
Claims25
A method of forming a conductive metal layer on a non-conductive surface, comprising:
- providing a non-conductive surface;
- contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface;
- contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface substantially free of palladium;
- and
- electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
A method of forming a conductive metal layer on a non-conductive surface, comprising:
- providing a non-conductive surface;
- applying a conditioner to the non-conductive surface to form a conditioned surface;
- contacting the conditioned surface with an aqueous stannous salt to form a sensitized surface;
- contacting the sensitized surface with an aqueous solution or mixture containing a silver salt at a pH in the range from about 6 to about 9 to form a catalyzed surface substantially free of palladium;
- and
- electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
Dependencies are inferred from the claim text.