US 6,645,346 B2Granted

Workpiece holding device for a bonding apparatus

AssigneeKabushiki Kaisha Shinkawa

InventorsTatsunari Mii, Shigeru Shiozawa, Yoshimitsu Terakado

Life of this patent

Estimating the term…

Loading patent…

Abstract

A workpiece retainer used in, for instance, a bonding apparatus for holding a workpiece during bonding being provide with plate springs that are driven towards the workpiece. Before the workpiece is pressed by the retainer, the end portions of plate springs protrude further toward the workpiece than the retaining surface of the workpiece retainer. When the workpiece is pressed by the retainer, the plate springs undergo elastic deformation and are pulled in the direction opposite from the workpiece so that the workpiece is pressed against a heat block by the retaining surface of the workpiece retainer; and when the workpiece is conveyed, the workpiece retainer is separated from the workpiece by a predetermined distance so that the plate springs undergo elastic recovery, thus preventing the workpiece from contacting the workpiece retainer.

Claims4

Dependent claims

A workpiece holding device used in a bonding apparatus that includes a heat block, a workpiece retainer for pressing a workpiece against said heat block, and a workpiece pressing means which is provided in said workpiece retainer and driven toward workpiece so as to be pressed against said workpiece, wherein said workpiece holding device is provided so that:

before said workpiece is pressed by said workpiece retainer, an end portion of said workpiece pressing means which faces said workpiece protrudes further toward said workpiece than a retaining surface of said workpiece retainer,
while said workpiece is being pressed by said workpiece pressing means, said workpiece pressing means undergoes elastic deformation and said end portion is pulled in a direction opposite from said workpiece so that said workpiece is pressed against said heat block by said retaining surface of said workpiece retainer, and
while said workpiece is being conveyed, said retaining surface of said workpiece retainer is separated from said workpiece by a predetermined distance so that said workpiece pressing means undergoes elastic recovery, thus preventing said workpiece from contacting said workpiece retainer.

Dependencies are inferred from the claim text.

Facts

Application: 10/071,654Filed 7 Feb 2002
Priority: JP 2001-0326468 Feb 2001
Published: US 2002/0105130 A18 Aug 2002
Granted: 11 Nov 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 72/7606
The wafers being placed on a susceptor, stage or support: characterised by edge clamping, e.g. clamping ring
H10P 72/7622
The wafers being placed on a susceptor, stage or support: characterised by supporting substrates others than wafers, e.g. chips
H10W 72/07178
Apparatus therefor: means for aligning
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered