Ball attached zero insertion force socket

A socket for selectively, mechanically and electrically connecting an electronic component to a circuit substrate, said socket comprising:

• a housing comprising a top mounting surface and bottom mounting surface, said top mounting surface having a plurality of apertures therein arranged to correspond with a plurality of contact terminals extending from said electronic component, and said bottom mounting surface having a plurality of apertures arrange to correspond with electrically conductive contacts of said circuit substrate;
• a cavity formed by said housing between said top mounting surface and said bottom mounting surface;
• a middle plate disposed in said cavity, said middle plate selectively movable relative to the housing between a contact and non-contact position, said plate having a plurality of apertures arranged to correspond with and receive said plurality of contact terminals of said electronic component;
• a plurality of contact assemblies disposed in said apertures of said housing bottom and extending upward into said apertures of said middle plate, said contact assemblies adapted to selectively form an electrical connection between said electronic component and said circuit substrate wherein said contact assemblies are sealingly press-fitted into said apertures of said housing bottom, said contact assemblies having upper and lower portions, said lower portion press fit into said apertures and fixed to said reflowable solder ball;
• said lower portion having a second portion having a generally conical shape tapering into said reflowable solder ball, said press-fit seal including an axial slot in said lower portion of said contact assembly, said axial slot fully closing when said contact assembly is inserted into said aperture;
• a reflowable solder ball fixed to each of said contact assemblies for forming said electrical connection between said electronic component and said circuit substrate;
• whereby said press-fit seal prevents reflowing solder to wick up said contact assemblies during reflow.

A contact assembly comprising:

• an upper portion;
• a lower portion, said lower portion further comprising:
• a first portion with a longitudinal cross-section corresponding to the shape of an aperture in which said contact assembly is to be mounted;
• a second substantially conical portion adapted for receiving a reflowable solder ball thereon;
• said lower portion further comprising an axial slot adapted for forming both a press-fit and sealed mounts between said aperture and said contact assembly.