Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsJun Ookura, Koji Harada
Life of this patent
Estimating the term…
Abstract
Target processing temperatures for a wafer and offset values are tabulated and stored in a temperature controller in advance. When a target processing temperature is changed, a hot plate temperature corresponding to the target processing temperature for the wafer is calculated based on the offset value in the table. Based on the calculated value, a heater controller controls a heater to change the hot plate temperature. Thereby, in a substrate heat processing apparatus for performing heat processing at different temperatures, an offset value corresponding to each temperature is automatically changed, whereby the substrate can be heated at an appropriate temperature.
Claims21
A substrate processing apparatus, comprising:
- a plate including:
- a plate body;
- temperature adjusting means for setting a substrate at a target processing temperature;
- and
- proximity pins being disposed on the plate body for supporting the substrate so that the substrate is lifted away from the upper surface of the plate body;
- storage means for storing a plurality of the target processing temperature and a temperature difference between the target processing temperature and an actual temperature of the plate when substrate is set at the target processing temperature for each of the plurality of target processing temperature;
- and
- control means for controlling the temperature adjusting means to change the temperature of the plate based on the temperature difference stored in the storage means for each of the plurality of target processing temperature whereby the temperature of the substrate is set at the target processing temperature.
A substrate processing apparatus, comprising:
- a hot plate including:
- a hot plate body;
- a heating element embedded in the hot plate body for heating a substrate to a target processing temperature;
- proximity pins being disposed on the plate body for supporting the substrate so that the substrate is lifted away from the upper surface of the plate body;
- storage means for storing a plurality of the target processing temperature and a temperature difference between the target processing temperature of the substrate and an actual temperature of the hot plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures;
- and
- control means for controlling the heating element to change the temperature of the hot plate based on the temperature difference stored in the storage means for each of the plurality of target processing temperatures whereby the temperature of the substrate is set at the target processing temperature.
A substrate processing apparatus, comprising:
- a plate including:
- a plate body;
- temperature adjusting means for each of partitioned areas for setting a substrate at a target processing temperature;
- and
- proximity pins being disposed on the plate body for supporting the substrate so that the substrate is lifted away from the upper surface of the plate body;
- storage means for storing a plurality of the target processing temperature and a temperature difference between the target processing temperature and an actual temperature of the plate when the substrate is set at the target processing temperature for each of the plurality of target processing temperature for each of the areas;
- and
- control means for controlling each of the temperature adjusting means to change the temperature of the plate in each of the areas based on the temperature difference stored in the storage means for each of the plurality of target processing temperatures whereby the temperature of the substrate is set at the target processing temperature.
A substrate processing apparatus, comprising:
- a hot plate including:
- a hot plate body;
- a heating element embedded in the hot plate body for each of partitioned areas for heating a substrate to a target processing temperature;
- proximity pins being disposed on the plate body for supporting the substrate so that the substrate is lifted away from the upper surface of the plate body;
- storage means for storing a plurality of the target processing temperatures and a temperature difference between the target processing temperature of the substrate and an actual temperature of the hot plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures for each of the areas;
- and
- control means for controlling each of the heating elements to change the temperature of the hot plate in each of the areas based on the temperature difference stored in the storage means for each of the plurality of target processing temperatures whereby the temperature of the substrate is set at the target processing temperature.
A substrate processing method for temperature-controlling a plate to set a substrate at a target processing temperature, the substrate being supported on proximity pins being disposed on an upper surface of the plate, the method comprising the steps of:
- storing a plurality of the target processing temperatures;
- storing a temperature difference between the target processing temperature and an actual temperature of the plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures;
- obtaining a predetermined temperature to which the plate needs to be temperature-controlled based on the target processing temperature of the substrate and the temperature difference;
- and
- temperature-controlling the plate to the predetermined temperature.
A substrate processing method for heating a hot plate to heat a to a target processing temperature, the substrate being supported on proximity pins being disposed on an upper surface of the hot plate, the method comprising the steps of:
- storing a plurality of the target processing temperatures;
- storing a temperature difference between the target processing temperature and an actual temperature of the hot plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures;
- obtaining a predetermined temperature to which the hot plate needs to be heated based on the target processing temperature and the temperature difference;
- and
- heating the hot plate to the predetermined temperature.
A substrate processing method for temperature-controlling a plate to temperature-control a substrate on the plate to a target processing temperature, the substrate being supported on proximity pins being disposed on an upper surface of the plate, the method comprising the steps of:
- storing a plurality of the target processing temperatures;
- storing a temperature difference between the target processing temperature of the substrate and an actual temperature of the plate in each of partitioned areas of the plate when the substrate is temperature-controlled to the target processing temperature for each of the plurality of target processing temperatures;
- obtaining a predetermined temperature to which the plate needs to be heated for each of the areas based on the target processing temperature and the temperature difference;
- and
- temperature-controlling the plate to the predetermined temperature.
A substrate processing method for heating a hot plate to heat a substrate on the hot plate to a target processing temperature, the substrate being supported on proximity pins being disposed on an upper surface of the hot plate, the method comprising the steps of:
- storing a plurality of the target processing temperatures;
- storing a temperature difference between the target processing temperature and an actual temperature of the hot plate in each of partitioned areas of the hot plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures;
- obtaining a predetermined temperature to which the hot plate needs to be heated for each of the areas based on the target processing temperature and the temperature difference;
- and
- heating the hot plate to the predetermined temperature.
A substrate processing apparatus, comprising:
- a plate including:
- a plate body;
- temperature adjusting means for setting a substrate at a target processing temperature;
- and
- proximity pins being disposed on the plate body for supporting the substrate so that the substrate is lifted away from the upper surface of the plate body;
- storage means for storing a plurality of the target processing temperatures and a temperature difference between the target processing temperature and an actual temperature of the plate when the substrate is set at the target processing temperature for each of the plurality of target processing temperatures;
- and
- control means for controlling the temperature adjusting means to change the temperature of the plate based on the temperature difference stored in the storage means for each of the plurality of target processing temperatures whereby the temperature of the substrate is set at the target processing temperature;
- wherein the control means obtains a temperature difference corresponding to an optional target processing temperature based on a correlation between a plurality of the target processing temperatures and the temperature differences, and obtains a predetermined temperature to which the plate needs to be temperature-controlled based on the optional target processing temperature and the temperature difference corresponding thereto.
A substrate processing method for temperature-controlling a plate to set a substrate at a target processing temperature, the substrate being supported on proximity pins being disposed on an upper surface of the plate, the method comprising the steps of:
- storing a plurality of the target processing temperatures of the substrate;
- storing a temperature difference between the target processing temperature and an actual temperature of the plate when the substrate is heated to the target processing temperature for each of the plurality of target processing temperatures;
- obtaining a predetermined temperature to which the plate needs to be temperature-controlled based on the target processing temperature of the substrate and the temperature difference;
- and
- temperature-controlling the plate to the predetermined temperature,
- wherein said step of obtaining the predetermined temperature comprises:
- obtaining a temperature difference corresponding to an optional target processing temperature based on a correlation between a plurality of the target processing temperatures and the temperature differences;
- and
- obtaining the predetermined temperature of the plate based on the optional target processing temperature and the temperature difference obtained in the previous step.
Dependencies are inferred from the claim text.