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US 6,644,964 B2Granted
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsEiichi Shirakawa, Toshichika Takei
Life of this patent
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Abstract
A heating processing chamber has a plate for holding a wafer and a heater heating the plate portion. The plate portion is composed of a plurality of divided plates separated from each other, and thereby the plate is hard to break even through a drastic change in temperature, thus making it possible to increase the durability of the plate.
Claims20
A substrate processing apparatus, comprising:
- a plate portion having a plurality of divided plates holding a substrate;
- and
- a heater heat-processing the substrate held by said plate portion,
- wherein said plurality of divided plates are horizontally spaced from each other to create a plurality of spaces.
1 more element
A substrate processing apparatus, comprising:
- a first plate portion having a plurality of horizontally divided and separated plates with a first space from each other and placed horizontally with a substrate, the first plate portion has a first surface and a second surface, the first surface holding the substrate;
- a first heater for heat-processing the substrate held by said first plate portion;
- and
- a gas supply mechanism supplying a first gas to the substrate through a first space between the adjacent divided plates of the first plate portion.
1 more element
A substrate processing method, comprising:
- holding a substrate on a first plate portion having a plurality of divided plates creating a plurality of first spaces therebetween;
- heat-processing the substrate on the first plate portion;
- separating the substrate from the first plate portion;
- and
- supplying a first cooling gas to the separated substrate through the plurality of first spaces.
2 more elements
Dependencies are inferred from the claim text.