Anchor base for heat sink of IC chipset

Abstract

An anchor base for a heat sink for an IC chipset is formed basically in a rectangular frame comprising: two lateral plates respectively formed at the bottom of two opposite lateral stiles of the rectangular frame, each of the two opposite lateral plates having a respective snap barb at its lower portion; a longitudinal resilient rod bridging the other two opposite lateral stiles of the rectangular frame, wherein two ends of the longitudinal resilient rod are extended downwardly to form a pair of protruding rods which are no shorter than the height of the lateral plates; a shorter resilient rod crossing the longitudinal resilient rod; wherein a protrusion is formed at the bottom of each of two ends of the shorter resilient rod. Thus, an anchor base for a heat sink can be made without any extra perforation or cutting steps. The shorter resilient rod uses the deformation torque of the longitudinal resilient rod so as to enhance the pressure of the shorter resilient rod on the heat sink for a close attachment of the heat sink to the chipset.

Dependencies are inferred from the claim text.