Heat-dissipating device with grounding capability

A heat-dissipating device for providing both heat dissipation and electromagnetic interference shielding to an electronic component that is mounted on a multi-layer circuit board, the circuit board having a grounding layer, said heat-dissipating device comprising:

• a heat-dissipating member made of a heat-conductive and electrically conductive material and adapted to be disposed on a heat-radiating side of the electronic component;
• a grounding member made of an electrically conductive material, said grounding member including a grounding tail and a grounding body connected to said grounding tail, said grounding tail being adapted to pass through the circuit board to connect electrically with the grounding layer and to dispose said grounding body between said heat-dissipating member and the circuit board;
• and
• a connecting member made of an electrically conductive material, interconnecting said heat-dissipating member and said grounding member, and adapted to be secured on the circuit board, thereby retaining said heat-dissipating member on the circuit board, said connecting member cooperating with said grounding member to make electrical connection between said heat-dissipating member and the grounding layer of the circuit board.