Semiconductor device with protective layer
AssigneeKabushiki Kaisha Toshiba
InventorsTakamasa Usui, Sachiyo Ito
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Abstract
A semiconductor device includes a substrate and a first insulating film provided above the semiconductor substrate. A first interconnecting layer is provided on the first insulating film. A second insulating film is provided above the first interconnecting layer and the first insulating layer. A first protective film is provided above the second insulating film and composed substantially of metal material. A second protective film is composed substantially of a passivity of the metal material and provided on a surface of the first protective film.
Claims20
A semiconductor device comprising:
- a semiconductor substrate;
- a first insulating film provided above the semiconductor substrate;
- a first interconnecting layer provided on the first insulating film;
- a second insulating film provided above the first interconnecting layer and the first insulating layer;
- a first protective film provided above the second insulating film, composed substantially of metal material;
- and
- a second protective film composed substantially of a passivity of the metal material, provided on a surface of the first protective film.
A semiconductor device comprising:
- a semiconductor substrate;
- a first insulating film provided above the semiconductor substrate;
- a first interconnecting layer provided on the first insulating film;
- a second insulating film provided above the first interconnecting layer and the first insulating layer;
- a passivation film provided above the second insulating film, composed substantially of metal material, and having a function of protecting the first insulating film and the first interconnecting layer and a function of releasing heat from the first interconnecting layer;
- and
- a passive covering film of the metal material provided on a surface of the passivation film, and having a function of protecting the first insulating film and the first interconnecting layer.
Dependencies are inferred from the claim text.