Semiconductor device with resistor layer having heat radiation path to semiconductor substrate

A semiconductor device comprising:

• a semiconductor substrate having a major surface;
• an isolation insulating film selectively formed on said major surface;
• a resistor layer formed on said isolation insulating film;
• an interlayer insulation film covering said semiconductor substrate, said isolation insulating film and said resistor layer;
• first and second interconnection layers disposed on said interlayer insulation film;
• a first conductive plug selectively buried in said interlayer insulation film and having an upper end connected to said first interconnection layer and a lower end connected to one end of said resistor layer and a first portion of said major surface of said semiconductor substrate which is adjacent to said isolation insulating film,
• said first conductive plug being rectangular in cross section along said major surface with its long sides extending along a main direction to connect said one end and the other end of said resistor layer and its short sides extending along a direction orthogonal to said main direction;
• and
• a second conductive plug selectively buried in said interlayer insulation film and having an upper end connected to said second interconnection layer and a lower end connected to said other end of said resistor layer.